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WAFER BUMPING STENCIL
For Printing Conductive Polymer or Solder Paster Bumps Directly into Silicon
Wafers as an Alternative to the C4 Process
Photo Stencil offers 3 different Stencil Techniques for Wafer Bumping Stencils
Chem-Etch
Laser-Cut
Nickel Additive
E X A M P L E S
4 MIL PITCH
2 Mil Apertures
1 to 2 Mil Thick Foil
8 MIL PITCH
4 Mil Apertures
2 Mil Thick Foil
12 MIL PITCH
6 Mil Apertures
3 Mil Thick Foil
WAFER SHOWING
6 Mil Conductive
Polymer Bumps on 12 Mil center
WAFER BUMPING STENCIL
12 Mil Thick, 6 Mil Aperture
with over 110,000 apertures in the stencil
