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TWO PRINT STENCIL
Mixed(Flip Chip/SMT) Technology
  • Stencil #1 Prints Flip Chip Paste
  • Stencil #2 Prints SMD Paste
  • Stencil #2 Has Relief Etch so the Paste from Stencil #1 is Undisturbed during Stencil #2 Printing
  • Flip Chip's and SMD 's are Placed and Sent to Reflow
  • Laser-Cut Stencil
  • Electropolished
  • 5 mil apertures
  • 3 mil thick foil
  • Hybrid Stencil
  • Electropolished
  • 7 mil thick
  • Relief Etch 4 mil thick
 
Two Print Stencils Allow Different Material to be Used During the Separate
Print Operations
FLIP CHIP
TYPE
1ST PRINT
FLIP CHIP SITE
2nd PRINT
SMT SITES
 
 
SOLDER
FLUX
SOLDER PASTE
SOLDER
SOLDER PASTE
SOLDER PASTE
CONDUCTIVE EPOXY
CONDUCTIVE EPOXY
SOLDER PASTE