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FLIP CHIP STENCILS

Used to print eutectic Solder Paste, Flux, or Conductive Epoxies on a
PCB or Package Substrate.

Photo Stencil 3 Different Stencils Technologies for Flip Chip Stencils:

  • Chem-Etch
  • Laser-Cut
  • Nickel Additive
E X A M P L E S
         
4 MIL PITCH
2 MIL Apertures
1 or 2 MIL Thick Foil
Laser-Cut or Nickel Additive
8 MIL PITCH
4 MIL Apertures
2 MIL Thick Foil
Laser-Cut or Nickel Additive
16 MIL PITCH
8 MIL Apertures
3 to 4 MIl Thick Foil
Laser-Cut or Chem-Etch
         
Flip Chip Stencil
  • SEM View/Squeegee Side
  • Laser-Cut Stencil
  • 1600 Magnification
  • 2 MIL Thick Foil
  • 2 MIL Opening