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- Photo Stencil's BGA Reballing Tool creates the ability to repair BGA packages that have been mis-soldered. The tool consist to two components: a custom designed stack of Titanium Nitride coated platers, an anodized aluminum mooring station, and a distribution tube.
- BGA package are held precisely in position by the lower plate by the upper plates guide the solder ballsaccurately into the pads.
- A non solder-wetting Titanium Nitride coating allows reflow with the upper plate still in place,simplifying the reballing process and greatly reducing the possibility of disturbing balls before and during the reflow.
- The non static mooring stationia designed to maximizeefficiency in ball placement to increase product throughput.it can accomodate a wide variety of custom designed plates.
- The distribution tube ensures that all apertures are quickly filled and greatly reduces the possibility of double-reballing or ball shearing.
- Plates can be custom designed for a range of products from flash memory micro BGA's to 500 I/C Microprocessor BGA's and ball sizes from 12 to 30 mils. Photo Stencil can design plates to match almost any applications.
- The BGA Reballing Tool can also can be used for low-volume and prototype BGA assembly.
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