| SOLDER PASTE |
[ 1 - 2 - 3 ] |
| Flux Type |
Water-Soluble |
| Formula |
HydroMark 531 |
HydroMark 522L |
R562 |
| Products Characteristics |
This highly-active, anti-slump paste is produced consistently so that every batch results in high yield manufacturing. HydroMark 531 offers extremely robust printing, even with an idle time of up to 1 hour and/or with print speeds of 150mm/sec. This very active formula is effective on a wide variety of metallization, including palladium. Compatible with enclosed print head systems. HydroMark 531 is also suitable for use on low temperature soldering alloys such as Sn43Pb43Bi14. |
Extremely robust and stable paste specially designed for the printing requirements of µCSP, µBGA and 0201 components. Its excellent paste release and print stability makes it ideal for challenging designs with ultra-fine pitches and small stencil openings. HydroMark 522L possesses excellent printing characteristics to a wide variety of melallization with an anti-slump property. |
Designed to withstand harsh processing environment with minimal void production. R562 has a stencil life of over 8 hours and exhibits excellent print characteristics and activity in a wide range of humidity (10-85%RH). R562 can withstand multiple reflow profiles before cleaning operation is required. Compatible with enclosed print head systems. |
| Residue removal method |
Use de-ionized water at 49-60 °C (120-140 °F). |
Use de-ionized water at 49-60°C (120-140 °F). |
Use de-ionized water at 49-60 °C (120-140 °F). |
| Atmosphere required for reflow |
Air or Nitrogen |
Air or Nitrogen |
Air or Nitrogen |
| Compliant specification |
IPC ANSI/J-STD-004, Flux designator 0RM0 |
IPC ANSI/J-STD-004, Flux designator 0RH0 |
IPC ANSI/J-STD-004, Flux designator 0RH0 |
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| Solder paste formulas for syringe dispensing applications |
| Flux Type |
No-Clean |
Water-Soluble |
| Formula |
R276 |
R500 |
| Product Characteristics |
Provides optional performance in all types of dispensing applications. R276 is packaged void-free to ensure consistent dispensing in high speed automated processes. Exhibits excellent dispensing characteristics with a wide range of needle diameters. R276 is also suitable for Lead-Free applications. |
The activator package in this formula is aggressive enough to remove tenacious oxide layers or solder to OSP coated boards. R500 delivers excellent wetting characteristics. |
| Residue removal method |
Not normally required. |
Use deionized water at 49-60°C (120-140°F) . |
| Atmosphere required for reflow |
Air or Nitrogen |
Air or Nitrogen |
| Compliant specification |
Bellcore Issue 1,GR-78-CORE, IPC ANSI/J-STD-004, Classification R0L0 |
IPC ANSI/J-STD-004,Classification 0RH0 |
