| SOLDER PASTE |
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| Solder paste formulas for stencil printing application |
| Flux Type |
NoClean |
| Formula |
PureMark 202 |
PureMark 277 |
FL250CR |
| Product characteristics |
Engineered to provide the print and reflow flexibility required by today's advanced electronic assemblies. Consistent print volume regardless of process parameters and 0201 application capable. Wide reflow process window and soft probe-friendly residue for ICT in all applications. Capable of printing after downtimes of over two hours with an effective first print down to 20 mils. Archives print speeds of up to 200mm/sec/ Compatible with enclose print head systems. |
PureMark 277 is specially designed for ultra-fine pitch printing for µCSP, µBGA and trough-hole application. Its flux system provides maximum stencil release and excellent slump resistance during printing and preheating. |
FL250CR is engineered for high speed printing of up to 100mm/sec. An extremely rebust formula, FL250CR permits first print without kneading even after an hour of relax time. FL250CR provides excellent printing characteristics of up to 16 mils pitch possesses long stencil life of up to 16 hours (process dependent). |
| Residue removal method |
Not normally required but its residue can be easily removed using automated cleaning equiptment (in-line or batch) with a variety of available cleaning agents. |
Not normally required but its residue can be easily removed using automated cleaning equiptment (in-line or batch) with a variety of available cleaning agents. |
Not normally required but its residue can be easily removed using automated cleaning equiptment (in-line or batch) with a variety of available cleaning agents. |
| Atmosphere required for reflow |
Air or Nitrogen |
Air or Nitrogen |
Air or Nitrogen |
| Compliant specification |
Bellcore Issue 1, GR-78-CORE, IPC ANSI/J-STD-004, Flux designator R0L0 |
Bellcore Issue 3, TR-NWT-000078, IPC ANSI/J-STD-004, Flux designator R0L0 |
Bellcore Issue 3, TR-NWT-000078, IPC ANSI/J-STD-004, Flux designator R0L0 |
| |
| Flux Type |
No-Clean |
| Formula |
R286LT |
TCS-001 |
TCS-104 |
| Product characteristics |
An anti-slump formula meant for low temperature soldering alloys such as Sn43Pb43Bi14. R286LT delivers exceptional printing characteristics to a wide variety of metallic substrates. |
TCS-001 is a RMA type paste that possesses excellent printing and high slump resistance characteristics. Capable of printing 0.3mm pitch and allows printing on a stencil for as long as 4 to 6 hours. |
RA type, for applications that require high activity and reliable residue without the need of cleaning. Excellent printing and slump resistance characteristics. Shows little rheological change in viscosity even after continuous printing for 4 to 6 hours. |
| Residue removal method |
Not normally required but its residue can be easily removed with the aid of Kester #5252, #5252M or #5240. |
Not normally required |
Not normally required |
| Atmosphere required for reflow |
Air or Nitrogen |
Air or Nitrogen |
Air or Nitrogen |
| Compliant specification |
Bellcore Issue 1, GR-78-CORE, IPC ANSI/J-STD-004, Flux designator R0L0 |
JIS-Z-3197, JIS-Z-3284 IPC ANSI/J-STD-004, Flux designator R0L1 |
JIS-Z-3197, JIS-Z-3284 |
