| SOLDER PASTE |
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| Solder Paste Formulas for Surface Mount and General Electronic Assemblies |
All Kester solder paste formulas are manufactured using highest quality raw materials available. Kester's worldwide research facilities work together to design solder paste formulas which bring the latest technological developments to electronic manufacturers around the globe. |
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Recommended Formulas |
| Application |
Alloy** |
Melting Range |
Stencil Printing |
General Syringe Dispensing |
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° F |
°C |
No-Clean |
Water Soluble |
No-Clean |
Water Soluble |
| Standard SMT |
Sn63Pb37 |
361 |
183 |
PureMark 202, PureMark 277, FL250CR |
HydroMark 531, HydroMark 522L, R562 |
R276 |
R500 |
| Standard SMT |
Sn62Pb36Ag02 |
354-372 |
179-189 |
PureMark 202, PureMark 277, FL250CR |
HydroMark 531, HydroMark 522L, R562 |
R276 |
R500 |
| Lead-Free |
Sn96.5Ag3.5 |
430 |
221 |
R905 |
EnviroMark 522 R520A |
R276 |
R505 |
| Lead-Free |
Sn96.5Ag3.0Cu0.5 |
423 |
217 |
R905 |
EnviroMark 522 R520A |
R276 |
R505 |
| Low Temperature |
Sn43Pb43Bi14 |
291-325 |
144-163 |
R286LT |
HydroMark 531 |
R276 |
R500 |
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| Power Type |
Mesh Designation |
Typical Particle Diameter |
Recommended Surface Mount Application (Pitch) |
| Type 3 |
-325 +500 |
25 to 45 micron |
Down to 16 mil |
| Type 4 |
-400 +500 |
25 to 38 micron |
Down to 12 mil |
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| Jar |
Cartridge |
| 250 gram |
500 grams |
| 500 gram |
1000 grams |
| *Jars are sized to fit Malcom* style viscometer |
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