| SOLDER FLUXES |
[ 1 - 2 - 3 - 4 ] |
| Component Lead Tinning Fluxes |
| Flux Type |
Rosin Non-Activated (R) |
Rosin Mildly Activated (RMA) |
Rosin Activated (RA) |
| Formula |
1429 |
2166-BN |
182 |
| Percent solids |
17.6 |
40.0 |
50 |
| Specific gravity (gm/cc) at 25°C (typical) |
1.061 |
1.144
|
0.919 |
| Products Characteristics |
Halide activated, water based on self neutralizing flux originally developed by Battelle Institute. |
High active, water-based flux designed for wave soldering and dipping applications for semiconductor component lead timing. |
These active formulations are designed for high-speed wave applications. Varied solids content and halide activity available. |
| Compliant specification |
IPC ANSI/J-STD-004 Flux designator ORH1 |
IPC ANSI/J-STD-004 Flux designator ORH1 |
IPC ANSI/J-STD-004 Flux designator ORH1 |
| Residue removal method |
Residue is removed with hot de-ionized or soft waters at 65-76°C (150-170°F) |
Residue is removed with hot de-ionized or soft waters at 65-76°C (150-170°F) |
Residue is removed with hot de-ionized or soft waters at 65-76°C (150-170°F) |
| Thinner no. |
De-ionized water. |
Does not require the addition of thinner to replace evaporated solvent; however, periodic replacement with fresh flux is recommended. |
Kester #4169 |
| |
|
|
|
| Chemical products |
| Chemical Type |
Copper-Nu® |
Nickle-Nu® |
solder-Nu® |
| Formula |
5520 |
5530 |
5560 |
| Product characteristics |
Non-fuming acidic solution provides a controlled amount of etching to copper surfaces prior to plating or coating |
Non-fuming acidic solution provides a controlled amount of etching to surfaces made from nickel and nickel alloys. |
Non-fuming acidic solution provides a controlled amount of the etching to solder, tin or silver plated surfaces. |
| |
|
|
|
|
| Chemical Type |
Dross Inhibiting Fluid |
Dross Eliminator® |
Scale-Off® |
Neutralizer |
| Formula |
5751 |
5744 |
5566 |
5760 |
| Product characteristics |
A highly refined synthetic fluid composition primarily designed for use in automatic soldering machines to minimize solder oxidation and drossing. Eliminates icicling and bridging by reducing both surface tension and interfacial tension between the solder and the metal surfaces being soldered. Reduces solder usage and facilitates solder flow. Kester #5751 is soluble in water, solvents (e.g chlorinated/fluorinated solvents) and alcohol. |
For the reduction of dross scrap. Chloride-free, inorganic white powder formulated to remove dross through converting dross back to solder from still solder pots or wave soldering machine. Does not decompose to sticky residues. Low fuming and stable even at temparature below 260°C (500°F). |
Descaler for cleaning water wash equipment. Hardened mineral deposits (scale) on screens, spray, nozzles, heating elements and tank surfaces are removed with Scale-Off® |
Effective in completely solubilizing chloride complex residues that result when soldering with organic or inorganic fluxes. |
