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SOLDER FLUXES
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Flux residue remover
Flux Type Aqueous Saponifier Halogen-Free Stencil Cleaner Halogen-Free Solvent
Formula 5768 Bio-Kleen® 5252 5252M
Product Characteristics Rosin residue can be easily removed on an aqueous solution through saponification. Designed for difficult to remove solder paste residues. It is non-active with most with most metals present on electronic assemblies. Multi-purpose ozone depletion potential free solvent cleaner developed for the cleaning of stencil, misprinted circuit board and mechanical devices. Not ozone depletion. Suitable substitute for chlorinated solvents. Fast air drying, non-ionic, non-corrosive and non-carcinogenic.
Application This concentrated formula is intended to be use at a 5-15% concentration of 1-4% Bio-Kleen® can assist on removing additional no-clean flux residues. Can be heated 71°C (160°F) to further facilitate residue removal. Designed to be used in a batch or in-line cleaning system. Not recommended for use in manual or ultrasonic cleaning operations. Designed for use in dipping, spraying and localized cleaning. Sufficient solvent should be used to remove the dissolved residue from the parts being cleaned. For removal of residue from rosin and other flux residues on stencils and circuit boards. Designed for immersion cleansing method where the residue is completely immersed in the solvent.
Flamability Concentrate, Combustible Flammable Flammable
       
Rosin based liquid fluxes
Flux Type Rosin Non-Activated (R) Rosin Mildly Activated (RMA) Rosin Activated (RA)
Formula 145 186 Series 182 182
Percent solids 25 18 to 36 25 50
Specific gravity (gm/cc) at 25°C (typical) 0.844

0.879 (186) 0.848 (186-25) 0.831 (186-18)

0.844 0.928
Products Characteristics Excellent for solderability test procedures specified by military and commercial industries. Designed for high thermal stability and superior solderability. Kester #186 is available in 18, 25 and 36 percent solid formulations. IPC designated formulation for solderability testing. Kester's active, non-corrosive, rosin type flux. It is used on surfaces which more difficult to solder.
Compliant specification

IPC ANSI/J-STD-004 Flux designator ROLO

IPC ANSI/J-STD-004 Flux designator ROLO

IPC ANSI/J-STD-004 Flux designator ROLO

IPC ANSI/J-STD-004 Flux designator ROM1

Residue removal method Residue is non-corrosive, but may be removed with solvent or with Kester's #5768 Bio-Kleen® saponifier at 7-10% solution in de-ionized or soft water at 49-60°C (120-140°F) Residue is non-corrosive, but may be removed with solvent or with Kester's #5768 Bio-Kleen® saponifier at 7-10% solution in de-ionized or soft water at 49-60°C (120-140°F) Residue is non-corrosive, but may be removed with solvent or with Kester's #5768 Bio-Kleen® saponifier at 7-10% solution in de-ionized or soft water at 49-60°C (120-140°F) Residue is non-corrosive, but may be removed with solvent or with Kester's #5768 Bio-Kleen® saponifier at 7-10% solution in de-ionized or soft water at 49-60°C (120-140°F)
Thinner no. 108 120 4662-SM 104