| SOLDER FLUXES |
[ 1 - 2 - 3 - 4 ] |
| Flux residue remover |
| Flux Type |
Aqueous Saponifier |
Halogen-Free Stencil Cleaner |
Halogen-Free Solvent |
| Formula |
5768 Bio-Kleen® |
5252 |
5252M |
| Product Characteristics |
Rosin residue can be easily removed on an aqueous solution through saponification. Designed for difficult to remove solder paste residues. It is non-active with most with most metals present on electronic assemblies. |
Multi-purpose ozone depletion potential free solvent cleaner developed for the cleaning of stencil, misprinted circuit board and mechanical devices. |
Not ozone depletion. Suitable substitute for chlorinated solvents. Fast air drying, non-ionic, non-corrosive and non-carcinogenic. |
| Application |
This concentrated formula is intended to be use at a 5-15% concentration of 1-4% Bio-Kleen® can assist on removing additional no-clean flux residues. Can be heated 71°C (160°F) to further facilitate residue removal. Designed to be used in a batch or in-line cleaning system. Not recommended for use in manual or ultrasonic cleaning operations. |
Designed for use in dipping, spraying and localized cleaning. Sufficient solvent should be used to remove the dissolved residue from the parts being cleaned. |
For removal of residue from rosin and other flux residues on stencils and circuit boards. Designed for immersion cleansing method where the residue is completely immersed in the solvent. |
| Flamability |
Concentrate, Combustible |
Flammable |
Flammable |
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| Rosin based liquid fluxes |
| Flux Type |
Rosin Non-Activated (R) |
Rosin Mildly Activated (RMA) |
Rosin Activated (RA) |
| Formula |
145 |
186 Series |
182 |
182 |
| Percent solids |
25 |
18 to 36 |
25 |
50 |
| Specific gravity (gm/cc) at 25°C (typical) |
0.844 |
0.879 (186) 0.848 (186-25) 0.831 (186-18) |
0.844 |
0.928 |
| Products Characteristics |
Excellent for solderability test procedures specified by military and commercial industries. |
Designed for high thermal stability and superior solderability. Kester #186 is available in 18, 25 and 36 percent solid formulations. |
IPC designated formulation for solderability testing. |
Kester's active, non-corrosive, rosin type flux. It is used on surfaces which more difficult to solder. |
| Compliant specification |
IPC ANSI/J-STD-004 Flux designator ROLO |
IPC ANSI/J-STD-004 Flux designator ROLO |
IPC ANSI/J-STD-004 Flux designator ROLO |
IPC ANSI/J-STD-004 Flux designator ROM1 |
| Residue removal method |
Residue is non-corrosive, but may be removed with solvent or with Kester's #5768 Bio-Kleen® saponifier at 7-10% solution in de-ionized or soft water at 49-60°C (120-140°F) |
Residue is non-corrosive, but may be removed with solvent or with Kester's #5768 Bio-Kleen® saponifier at 7-10% solution in de-ionized or soft water at 49-60°C (120-140°F) |
Residue is non-corrosive, but may be removed with solvent or with Kester's #5768 Bio-Kleen® saponifier at 7-10% solution in de-ionized or soft water at 49-60°C (120-140°F) |
Residue is non-corrosive, but may be removed with solvent or with Kester's #5768 Bio-Kleen® saponifier at 7-10% solution in de-ionized or soft water at 49-60°C (120-140°F) |
| Thinner no. |
108 |
120 |
4662-SM |
104 |
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