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SOLDER FLUXES
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Water-Soluble liquid fluxes
Flux Type Alcohol Base VOC-Free

Neutral PH Organic Water-Soluble

Organic Water-Soluble

Organic Halide-Free Water-Soluble

Organic, VOC-FreeNo-Clean VOC Free
Formula 2331-ZX 2224-25 2120 2220VF
Percent solids (typical) 33 25 14 7.2
Specific Gravity (gm/cc) at 25°C (typical) 0.899 0.882 0.862 1.058
Product Characteristics Original pH neutral organic flux designed for automated wave soldering applications. Highly active organic flux designed for automated wave soldering applications. Low solids flux for surface mount assemblies. Provides optimal board cleanliness. A high active organic flux that provides maximum capillary wetting action up plated through-holes, making it ideal for use on multi-layer boards. Minimizes icicling and bridging and produces bright, shiny solder joints. It is chemically compatible with most solder masks and board laminates and does not emit offensive odors during soldering. Suitable for spray, dip or foam applications.
Compliant specification IPC ANSI/J-STD-004 Flux designator ORH1 FIPC ANSI/J-STD-004 lux designator ORH1 IPC ANSI/J-STD-004 Flux designator ORH0 IPC ANSI/J-STD-004 Flux designator ORH1
Residue removal method Residue removal is required. Use soft or de-ionized water at temperatures of 49-65°C (120-150°F). Residue removal is required. Use soft or de-ionized water at temperatures of 49-65°C (120-150°F). Residue removal is required. Use soft or de-ionized water at temperatures of 49-65°C (120-150°F). Residue removal is required. Use soft or de-ionized water at temperatures of 43-60°C (110-140°F) with 2% solution of Kester # 5768 Bio-Kleen® saponifier.
Thinner no. 4662 4662 4240 De-ionized water